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MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

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MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

Name: MH310MH310DH310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings
Brand: Minghao
Price: 1 USD

Brand Name : Minghao

Model Number : MH310/MH310DH/310DL

Place of Origin : China

MOQ : 1 unit

Price : USD

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal

Supply Ability : 10 units

Delivery Time : 1 to 5 working days

Packaging Details : Wooden Box

Machine Description : 3D SPI

Model : MH310/MH310DH/310DL

Condition : Original and New

Functionality : Industrial use (SMT)

Packaging : Wooden Box

Lead Time : 30 to 40 working days

Payment : TT, PAYPAL, L/C, D/A, D/P, Western Union, MoneyGram

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Product Description: MH310 Series 3D Solder Paste Inspection (SPI) Machine

Manufacturer: Shenzhen Minghao Vision Technology Co., Ltd.

The MH310 Series is a high-precision, 3D optical inspection system designed for real-time detection of solder paste defects in SMT (Surface Mount Technology) production lines. Utilizing phase modulation contour measurement (PMP) technology, it ensures micron-level accuracy (0.37µm resolution) while maintaining high-speed performance. The system supports closed-loop feedback with printers, SPC data analysis, and multi-machine interoperability for Industry 4.0 smart manufacturing.

Key Features & Advantages

Feature	Benefit
Phase Modulation Contour (PMP) Technology	Achieves 3D measurement with 0.37µm resolution, detecting defects like insufficient/excessive solder, misalignment, and bridging.
Multi-Head Imaging	Simultaneous multi-angle inspection improves speed vs. traditional single-head SPI.
Far-Center Lens Static Compensation	Eliminates errors caused by FPC (flexible PCB) warping without Z-axis adjustment.
Printer Closed-Loop Control	Automatically sends stencil cleaning/alignment commands to printers to improve yield.
SPC & MES Integration	Real-time statistical process control (SPC) and compatibility with factory MES systems.
BadMark Sharing	Skips defective boards in mounters, boosting efficiency.

Technical Specifications (MH310/MH310DH/MH310DL Models)

Parameter	MH310	MH310DH	MH310DL
Inspection Area	50×50mm to 510×460mm	50×50mm to 510×600mm	50×50mm to 1200×460mm
Thickness Range	0.5mm–6mm	0.5mm–6mm	0.5mm–6mm
Component Height	Top/Bottom: ±10mm	Top: +10mm, Bottom: +40mm	Top: +40mm, Bottom: +40mm
Light Source	RGB-W 4-color integral light	Customizable multi-directional lighting	High-speed industrial camera
Detection Speed	Up to 900Kx (customizable)	Optimized for dual-head configurations	Large-area scanning

Applications

Post-Printing Inspection: Installed after solder paste printers in SMT lines.

Defect Types: Measures volume, height, misalignment, bridging, and solder splatter.

Industry 4.0: Supports data traceability, multi-machine control (1 operator:4 machines), and AI-driven analytics.

Certifications & Compliance

Patents for PMP technology, software copyrights, and ISO quality management certifications.

Target Industries: PCB assembly, automotive electronics, consumer electronics, and medical device manufacturing.

MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

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